Call for Papers
Power Semiconductor User Forum
Virtual Event

Submission deadline: 19 June 2021

Power semiconductors are key components in any kind of power supply, DC/DC converter or inverter. But the market for MOSFETs, IGBTs and modules is extremely diversified. There are a lot of manufacturers that offer such components in an overwhelming variety. On top of that, there are also emerging the new wide-bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN). How should power electronics developers find his or her way out through this jungle and identify the most suitable power semiconductor and topology for his or her application? What are the pros and cons of different power semiconductor solutions?

Another big issue right now is that lead times and component prices have risen dramatically. What can technical purchasers and developers do to manage this issue?

The virtual »Power Semiconductor User Forum«, organized by Markt&Technik and DESIGN&ELEKTRONIK from 26 to 27 October 2021, is there to give guidance to power electronics developers and technical purchasers. This conference will provide important basics and application advice for MOSFET & Co. Will a Superjunction MOSFET be sufficient for the targeted application, or might it make more sense to switch to GaN or SiC transistors? Will the selected driver IC also operate with other power semiconductor technologies? What variances are to be expected regarding the information in the data sheet? Which aspects are critical for a qualified preliminary selection and which further questions to the manufacturers will make decision-making and sourcing easier?

We look forward to receiving your proposals. The following subjects are mentioned as inspiration:

  • Types of power semiconductors (MOSFET, IGBT, Modules, SiC, GaN)
  • Pros and cons of each type
  • Failure mechanisms, robustness, reliability and degradation
  • Packaging and interconnection technology for power semiconductors and power modules
  • Package types and their respective pros and cons
  • Assembly and termination technology
  • Thermal management (within and outside of the package)
  • Circuitry (e.g., driver and protection)
  • Electromagnetic compatibility
  • Converter and inverter topologies and their respective pros and cons
  • Application examples (electromobility, renewable energies, traction, white/brown goods etc.)
  • Interaction with other components (e.g., passives, DC link, bus bar, etc.)
  • Cost analysis
  • Standards

Until 19 June 2021 you can submit proposals and actively contribute to the program. Please submit only technically in-depth papers; product- and marketing-related submissions will not be considered. Are you interested in product-specific presentations in our additional "Manufacturer Track"? Get in touch with us! Corina Prell, Sales Manager Events:

Location of event: virtual
Date: 26 – 27 October 2021